Package parameters/number of pins: 100
Encapsulation parameters/Encapsulation: LBGA
External dimensions/packaging: LBGA
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
EPF6016AFC100-3
|
Intel | 功能相似 | FBGA |
FPGA FLEX 6000 Family 16K Gates 1320 Cells 142.86MHz 0.42um Technology 3.3V 100Pin FBGA
|
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