Technical parameters/operating temperature (Max): 100 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 0.86V ~ 1.15V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 484
Encapsulation parameters/Encapsulation: FBGA-484
External dimensions/height: 2.55 mm
External dimensions/packaging: FBGA-484
Physical parameters/operating temperature: -40℃ ~ 100℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Intel | 完全替代 | BGA |
FPGA Stratix® III E Family 47500 Cells 375MHz 65nm Technology 0.9V 484Pin FC-FBGA
|
||
EP3SE50F484I3
|
Altera | 完全替代 | FBGA-484 |
FPGA Stratix® III E Family 47500 Cells 500MHz 65nm Technology 1.1V 484Pin FC-FBGA
|
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