Technical parameters/operating temperature (Max): 100 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 780
Encapsulation parameters/Encapsulation: BGA-780
External dimensions/height: 2.55 mm
External dimensions/packaging: BGA-780
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 3A001.a.7.a
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
EP3SE260H780C3
|
Intel | 完全替代 | BGA |
FPGA Stratix® III E Family 255000 Cells 500MHz 65nm Technology 1.1V 780Pin FC-HFBGA
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review