Technical parameters/frequency: 437.5 MHz
Technical parameters/RAM size: 423936 b
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 1.15V ~ 1.25V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: FBGA-256
External dimensions/packaging: FBGA-256
Physical parameters/operating temperature: -40℃ ~ 125℃ (TJ)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Intel | 完全替代 | BGA-256 |
FPGA Cyclone® III Family 5136 Cells 500MHz 65nm Technology 1.2V 256Pin TFBGA
|
||
EP3C5F256C6
|
Altera | 完全替代 | FBGA-256 |
FPGA Cyclone® III Family 5136 Cells 500MHz 65nm Technology 1.2V 256Pin TFBGA
|
||
|
|
Intel | 类似代替 | FBGA-256 |
集成电路
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