Technical parameters/power supply voltage (DC): 1.50 V
Technical parameters/I/O pin count: 426
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.425V ~ 1.575V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 672
Encapsulation parameters/Encapsulation: FBGA-672
External dimensions/height: 3 mm
External dimensions/packaging: FBGA-672
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Intel | 完全替代 | BGA |
Field Programmable Gate Array, 2852 CLBs, 25660-Cell, CMOS, PBGA672, 27 X 27MM, 1MM PITCH, FBGA-672
|
||
EP1SGX25CF672C6N
|
Altera | 完全替代 | FBGA-672 |
Field Programmable Gate Array, 2852 CLBs, 25660-Cell, CMOS, PBGA672, 27 X 27MM, 1MM PITCH, FBGA-672
|
||
|
|
Intel | 完全替代 | BGA |
FPGA - 现场可编程门阵列 FPGA - Stratix I GX 2566 LABs 455 IOs
|
||
EP1SGX25CF672C7N
|
Altera | 完全替代 | FBGA-672 |
FPGA - 现场可编程门阵列 FPGA - Stratix I GX 2566 LABs 455 IOs
|
||
EP1SGX25DF672C6N
|
Intel | 完全替代 | BGA |
FPGA - 现场可编程门阵列 FPGA - Stratix I GX 2566 LABs 455 IOs
|
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