Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 0 ℃
Package parameters/number of pins: 672
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Intel | 完全替代 | BGA |
FPGA - 现场可编程门阵列 FPGA - Stratix I GX 2566 LABs 455 IOs
|
||
EP1SGX25CF672C6
|
Altera | 完全替代 | FBGA-672 |
FPGA - 现场可编程门阵列 FPGA - Stratix I GX 2566 LABs 455 IOs
|
||
|
|
Intel | 类似代替 | BGA |
Field Programmable Gate Array, 2852 CLBs, 25660-Cell, CMOS, PBGA672, 27 X 27MM, 1MM PITCH, FBGA-672
|
||
EP1SGX25CF672C6N
|
Altera | 类似代替 | FBGA-672 |
Field Programmable Gate Array, 2852 CLBs, 25660-Cell, CMOS, PBGA672, 27 X 27MM, 1MM PITCH, FBGA-672
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review