Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
E-LIS3L02AS4
|
ST Microelectronics | 功能相似 | SOIC-24 |
MEMS惯性传感器的3轴 - 【 2G / 【 6克线性加速度计 MEMS INERTIAL SENSOR 3-Axis - 【2g/【6g LINEAR ACCELEROMETER
|
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