Technical parameters/RAM size: 32K x 8
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 112
Encapsulation parameters/Encapsulation: BGA-112
External dimensions/packaging: BGA-112
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Discontinued at Digi-Key
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
EFM32LG890F64-BGA112
|
Silicon Labs | 类似代替 | LFBGA-112 |
MCU 32Bit EFM32 ARM Cortex M3 RISC 64KB Flash 2.5V/3.3V 112Pin BGA
|
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