Technical parameters/RAM size: 32K x 8
Technical parameters/Analog to Digital Conversion (ADC): 1
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 40 ℃
Technical parameters/Digital to Analog Conversion (DAC): 1
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 112
Encapsulation parameters/Encapsulation: BGA-112
External dimensions/packaging: BGA-112
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
EFM32LG890F256-BGA112
|
Silicon Labs | 类似代替 | LFBGA-112 |
MCU 32Bit EFM32 ARM Cortex M3 RISC 256KB Flash 2.5V/3.3V 112Pin BGA
|
||
EFM32LG890F256-BGA112T
|
Silicon Labs | 类似代替 | LFBGA-112 |
ARM Microcontrollers - MCU 256K Flash 32K RAM 8x36 LCD AES
|
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