Package parameters/number of pins: 9
Encapsulation parameters/Encapsulation: MODULE
External dimensions/packaging: MODULE
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CM900DU-24NF
|
Mitsubishi | 功能相似 | MODULE |
Trans IGBT Module N-CH 1200V 900A 2550000mW 8Pin
|
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