Technical parameters/power supply voltage (DC): 3.60V (max)
Technical parameters/data rate: 227 Mbps
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 56
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN65LVDS93ADGGR
|
TI | 完全替代 | TSSOP-56 |
FlatLink变送器 FLATLINK TRANSMITTER
|
||
SN65LVDS93AZQLR
|
TI | 完全替代 | BGA-56 |
FlatLink变送器 FLATLINK TRANSMITTER
|
||
SN75LVDS83ADGG
|
TI | 完全替代 | TSSOP-56 |
FlatLinkâ ?? ¢变送器 FLATLINK⢠TRANSMITTER
|
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