Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP-48
External dimensions/packaging: TSSOP-48
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN65LVDS96DGG
|
TI | 类似代替 | TSSOP-48 |
TEXAS INSTRUMENTS SN65LVDS96DGG 芯片, 串化/解串器, 1.428GBPS, TSSOP-48
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review