Technical parameters/power supply current: 150 mA
Technical parameters/power supply voltage: 3.135V ~ 3.465V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: BGA-256
External dimensions/packaging: BGA-256
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Dallas Semiconductor | 完全替代 |
Framer E1/J1/T1 3.3V 256Pin BGA
|
|||
DS21455
|
Maxim Integrated | 完全替代 | BGA-256 |
Framer E1/J1/T1 3.3V 256Pin BGA
|
||
DS3112N
|
Maxim Integrated | 完全替代 | BGA-256 |
电信接口IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX
|
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