Technical parameters/output current: 20 mA
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 10
Encapsulation parameters/Encapsulation: HVSON
External dimensions/packaging: HVSON
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS2781G+
|
Maxim Integrated | 类似代替 | TDFN-10 |
MAXIM INTEGRATED PRODUCTS DS2781G+ 芯片, 电量计
|
||
DS2781G+
|
Dallas Semiconductor | 类似代替 |
MAXIM INTEGRATED PRODUCTS DS2781G+ 芯片, 电量计
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review