Technical parameters/memory capacity: 16000 B
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TO-226-3
External dimensions/packaging: TO-226-3
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards:
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS2505+T&R
|
Dallas Semiconductor | 完全替代 |
EPROM, 1-Wire网络, 16384bit, 64Pages x 256bit, 2.8V至6V, TO-226-3
|
|||
DS2505/T&R
|
Maxim Integrated | 功能相似 | TO-226-3 |
OTP ROM, 16KX1, MOS, PBCY3, TO-92, 3 PIN
|
||
DS25051A
|
Maxim Integrated | 功能相似 |
OTP ROM, 16KX1, PBCY3, TO-92, 3Pin
|
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