Technical parameters/memory capacity: 500 B
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Package parameters/number of pins: 2
Encapsulation parameters/Encapsulation: CAN
External dimensions/length: 17.35 mm
External dimensions/width: 17.35 mm
External dimensions/height: 5.89 mm
External dimensions/packaging: CAN
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: User/Product Validation, Embedded Design&Development, Embedded Design&Development
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS1973-F3
|
Maxim Integrated | 功能相似 | F3 MicroCan |
4Kbit EEPROM iButton
|
||
DS1973-F5+
|
Maxim Integrated | 完全替代 | Can |
MAXIM INTEGRATED PRODUCTS DS1973-F5+ 芯片, 特殊功能
|
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