Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ULN2003ADR
|
TI | 功能相似 | SOIC-16 |
TEXAS INSTRUMENTS ULN2003ADR 双极晶体管阵列, NPN, 50 V, 500 mA, SOIC
|
||
ULN2003ADR
|
Chipswinner | 功能相似 |
TEXAS INSTRUMENTS ULN2003ADR 双极晶体管阵列, NPN, 50 V, 500 mA, SOIC
|
|||
ULN2004D1013TR
|
ST Microelectronics | 功能相似 | SOIC-16 |
STMICROELECTRONICS ULN2004D1013TR 双极晶体管阵列, 达林顿, NPN, 50 V, 500 mA, 1000 hFE, SOIC
|
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