Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Maxim Integrated | 类似代替 | EDIP-32 |
MAXIM INTEGRATED PRODUCTS DS1556-70IND+ 芯片, 实时时钟
|
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