Technical parameters/number of circuits: 6
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN74S174N
|
TI | 类似代替 | DIP-16 |
HEX路/四路D型触发器与Clear HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
|
||
|
|
AMD | 类似代替 | DIP |
HEX路/四路D型触发器与Clear HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
|
||
SN74S174NE4
|
TI | 类似代替 | DIP |
HEX路/四路D型触发器与Clear HEX/QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR
|
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