Technical parameters/RAM size: 32768 B
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LFBGA-337
External dimensions/packaging: LFBGA-337
Physical parameters/operating temperature: 0℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DM355SDZCEA216
|
TI | 功能相似 | LFBGA-337 |
数字信号处理器和控制器 - DSP, DSC Dig Media Sys-on- Chip
|
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