Package parameters/number of pins: 119
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Physical parameters/operating temperature: 0℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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GSI | 功能相似 | FBGA |
SRAM Chip Sync Dual 2.5V/3.3V 18M-Bit 1M x 18 5.5ns/2.5ns 119Pin F-BGA
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