Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 14
Encapsulation parameters/Encapsulation: CDIP
External dimensions/packaging: CDIP
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DG306ABK
|
Maxim Integrated | 类似代替 | CDIP-14 |
CMOS模拟开关 CMOS Analog Switches
|
||
DG307ACJ
|
Vishay Semiconductor | 功能相似 |
CMOS模拟开关 CMOS Analog Switches
|
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