Technical parameters/number of contacts: 50
Technical parameters/polarity: Male
Technical parameters/Contact electroplating: Gold
Technical parameters/number of rows: 3
Technical parameters/number of pins: 50
Technical parameters/Contact rated current: 7.50 A
Encapsulation parameters/installation method: Solder Cup
Physical parameters/contact material: Copper Alloy
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: Communication and Networking, Industrial
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DDM50P
|
Future Communications IC | 完全替代 |
连接器, D-SUB, 公, 50路, 焊接
|
|||
DDM50P
|
ITT Corporation | 完全替代 |
连接器, D-SUB, 公, 50路, 焊接
|
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