Technical parameters/number of pins: 4
Technical parameters/forward current: 1 A
Technical parameters/forward voltage (Max): 1.1 V
Technical parameters/operating temperature (Max): 150 ℃
Technical parameters/operating temperature (Min): -55 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 4
Encapsulation parameters/Encapsulation: SOIC
External dimensions/length: 8.51 mm
External dimensions/width: 6.5 mm
External dimensions/height: 2.6 mm
External dimensions/packaging: SOIC
Other/Product Lifecycle: Active
Other/Packaging Methods: Cut Tape (CT)
Other/Manufacturing Applications: Power Management, Aerospace, Defence, Military
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/military grade: Yes
Compliant with standard/REACH SVHC version: 2015/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DBLS101G
|
Taiwan Semiconductor | 完全替代 | SOIC |
TAIWAN SEMICONDUCTOR DBLS101G 二极管 桥式整流, 单相, 50 V, 1 A, SOIC, 1.1 V, 4 引脚
|
||
DBLS101G
|
Multicomp | 完全替代 | SOIC |
TAIWAN SEMICONDUCTOR DBLS101G 二极管 桥式整流, 单相, 50 V, 1 A, SOIC, 1.1 V, 4 引脚
|
||
DBLS103G
|
Taiwan Semiconductor | 类似代替 | SOIC |
MULTICOMP DBLS103G 二极管 桥式整流, 单相, 200 V, 1 A, SOIC, 1.1 V, 4 引脚
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review