Encapsulation parameters/Encapsulation: DFM
External dimensions/packaging: DFM
Other/Product Features: Suitable for automatic insertion and glass passivation chip intersections
Other/Continuous Reverse Voltage: 800V
Other/RMS voltages: 560V
Other/Storage Temperature: -65℃~150℃
Other/Packaging: DFM
Compliant with standards/RoHS standards: RoHS Compliant
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