Technical parameters/Contact electroplating: Gold
Technical parameters/insulation resistance: 5000 MΩ
Technical parameters/number of plug and unplug cycles: 500
Technical parameters/operating temperature (Max): 165 ℃
Technical parameters/operating temperature (Min): -65 ℃
Technical parameters/rated voltage: 1500 V
Encapsulation parameters/installation method: Panel, Solder
Encapsulation parameters/Encapsulation: -
External dimensions/length: 29.7 mm
External dimensions/width: 17.5 mm
External dimensions/height: 17.5 mm
External dimensions/packaging: -
External dimensions/inner diameter dimensions: 1.27 mm
Physical parameters/shell color: Silver
Physical parameters/contact material: Phosphor Bronze
Physical parameters/insulation material: Teflon
Physical parameters/operating temperature: -65℃ ~ 165℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: RF Communications, Sensing and Instrumentation, Communication and Networking, RF Communication, Wireless, Sensing&Instrumentation, Communications&Networking, Wireless
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC23558
|
Multicomp | 类似代替 |
MULTICOMP MC23558 射频同轴连接器, N型
|
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