Technical parameters/number of contacts: 14
Technical parameters/Contact electroplating: Gold
Technical parameters/rated current: 1 A
Technical parameters/insulation resistance: 10000 MΩ
Technical parameters/number of rows: 2
Technical parameters/Contact resistance: 10 mΩ
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Encapsulation parameters/installation method: Through Hole
External dimensions/length: 17.17 mm
Physical parameters/color: Black
Physical parameters/contact material: Beryllium Copper
Physical parameters/operating temperature: -55℃ ~ 125℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
2227MC-14-03-F1
|
Multicomp | 功能相似 |
MULTICOMP 2227MC-14-03-F1 芯片和元件插座, 2227MC系列, DIP, 14 触点, 2.54 mm, 7.62 mm, 镀锡触芯
|
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