Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 484
Encapsulation parameters/Encapsulation: FBGA-484
External dimensions/packaging: FBGA-484
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards:
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CYD09S72V18-167BBXC
|
Cypress Semiconductor | 功能相似 | FBGA-256 |
CYD09S72V18 系列 9 Mb (128 K x 72) 1.8 V 4 ns 双端口 静态 RAM FBGA-256
|
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