Technical parameters/clock frequency: 300 MHz
Technical parameters/access time: 50 ns
Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.7V ~ 1.9V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: LBGA-165
External dimensions/height: 0.89 mm
External dimensions/packaging: LBGA-165
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Cypress Semiconductor | 完全替代 | BGA |
SRAM Chip Sync Dual 1.8V 144M-bit 4M x 36 165Pin FBGA
|
||
CY7C1614KV18-250BZI
|
Cypress Semiconductor | 功能相似 | FBGA-165 |
SRAM Chip Sync Dual 1.8V 144M-bit 4M x 36 0.45ns 165Pin FBGA Tray
|
||
CY7C1614KV18-333BZC
|
Cypress Semiconductor | 功能相似 | FBGA-165 |
SRAM Chip Sync Dual 1.8V 144M-bit 4M x 36 0.45ns 165Pin FBGA Tray
|
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