Technical parameters/digits: 18
Technical parameters/access time (Max): 0.45 ns
Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.7V ~ 1.9V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: FBGA-165
External dimensions/height: 0.89 mm
External dimensions/packaging: FBGA-165
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY7C1518KV18-333BZC
|
Cypress Semiconductor | 完全替代 | LBGA-165 |
72兆位的DDR - II SRAM的2字突发架构 72-Mbit DDR-II SRAM 2-Word Burst Architecture
|
||
CY7C1518KV18-333BZXI
|
Cypress Semiconductor | 功能相似 | LBGA-165 |
72兆位的DDR II SRAM的2字突发架构 72-Mbit DDR II SRAM 2-Word Burst Architecture
|
||
GS8662T18BGD-333I
|
GSI | 功能相似 | FBGA |
SRAM Chip Sync Single 1.8V 72M-Bit 4M x 18 0.45ns 165Pin FBGA Tray
|
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