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Description 7272 Mbit DDR II SRAM 2-Word Burst Architecture
Product QR code
Packaging FBGA-165
Delivery time
Packaging method Tray
Standard packaging quantity 1
352.42  yuan 352.42yuan
1+:
$ 405.2853
10+:
$ 394.7126
50+:
$ 386.6069
100+:
$ 383.7876
200+:
$ 381.6730
500+:
$ 378.8537
1000+:
$ 377.0915
2000+:
$ 375.3294
Quantity
1+
10+
50+
100+
200+
Price
$405.2853
$394.7126
$386.6069
$383.7876
$381.6730
Price $ 405.2853 $ 394.7126 $ 386.6069 $ 383.7876 $ 381.6730
Start batch production 1+ 10+ 50+ 100+ 200+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(3234) Minimum order quantity(1)
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Technical parameters/digits: 18

Technical parameters/access time (Max): 0.45 ns

Technical parameters/operating temperature (Max): 70 ℃

Technical parameters/operating temperature (Min): 0 ℃

Technical parameters/power supply voltage: 1.7V ~ 1.9V

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 165

Encapsulation parameters/Encapsulation: FBGA-165

External dimensions/height: 0.89 mm

External dimensions/packaging: FBGA-165

Physical parameters/operating temperature: 0℃ ~ 70℃

Other/Product Lifecycle: Unknown

Other/Packaging Methods: Tray

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: lead-free

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
CY7C1518KV18-333BZC CY7C1518KV18-333BZC Cypress Semiconductor 完全替代 LBGA-165
72兆位的DDR - II SRAM的2字突发架构 72-Mbit DDR-II SRAM 2-Word Burst Architecture
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CY7C1518KV18-333BZXI CY7C1518KV18-333BZXI Cypress Semiconductor 功能相似 LBGA-165
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GS8662T18BGD-333I GS8662T18BGD-333I GSI 功能相似 FBGA
SRAM Chip Sync Single 1.8V 72M-Bit 4M x 18 0.45ns 165Pin FBGA Tray

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