Technical parameters/digits: 36
Technical parameters/access time (Max): 0.45 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 1.7V ~ 1.9V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: LBGA-165
External dimensions/packaging: LBGA-165
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
Customs information/ECCN code: 3A991
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY7C1320KV18-250BZC
|
Cypress Semiconductor | 功能相似 | FBGA-165 |
CY7C1320JV18 18 Mb (512 K x 36) 1.8V 250 MHz DDR-II 2-字突发 SRAM-FBGA-165
|
||
CY7C1320KV18-250BZI
|
Cypress Semiconductor | 完全替代 | LBGA-165 |
18兆位的DDR II SRAM双字突发架构 18-Mbit DDR II SRAM Two-Word Burst Architecture
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||
CY7C1320KV18-250BZXC
|
Cypress Semiconductor | 功能相似 | FBGA-165 |
18兆位的DDR II SRAM双字突发架构 18-Mbit DDR II SRAM Two-Word Burst Architecture
|
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