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Description 18Megabit QDR ® II SRAM Four Word Burst Architecture 18 Mbit QDR ® II SRAM Four-Word Burst Architecture
Product QR code
Packaging LBGA-165
Delivery time
Packaging method Tray
Standard packaging quantity 1
67.41  yuan 67.41yuan
1+:
$ 77.5181
10+:
$ 74.1477
100+:
$ 73.5410
250+:
$ 73.0692
500+:
$ 72.3277
1000+:
$ 71.9907
2500+:
$ 71.5188
5000+:
$ 71.1144
Quantity
1+
10+
100+
250+
500+
Price
$77.5181
$74.1477
$73.5410
$73.0692
$72.3277
Price $ 77.5181 $ 74.1477 $ 73.5410 $ 73.0692 $ 72.3277
Start batch production 1+ 10+ 100+ 250+ 500+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(9471) Minimum order quantity(1)
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Technical parameters/power supply voltage: 1.7V ~ 1.9V

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 165

Encapsulation parameters/Encapsulation: LBGA-165

External dimensions/packaging: LBGA-165

Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)

Other/Product Lifecycle: Unknown

Other/Packaging Methods: Tray

Compliant with standards/RoHS standards: Non-Compliant

Compliant with standards/lead standards: Contains Lead

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
CY7C1313KV18-250BZC CY7C1313KV18-250BZC Cypress Semiconductor 类似代替 FBGA-165
CY7C1313KV18 系列 18Mb (1M x 18) QDR® II SRAM 四字突发架构
PDF
CY7C1313KV18-250BZXC CY7C1313KV18-250BZXC Cypress Semiconductor 类似代替 FBGA-165
SRAM Chip Sync Dual 1.8V 18M-Bit 1M x 18 0.45ns 165Pin FBGA Tray
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