Technical parameters/power supply voltage: 1.7V ~ 1.9V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: LBGA-165
External dimensions/packaging: LBGA-165
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY7C1313KV18-250BZC
|
Cypress Semiconductor | 类似代替 | FBGA-165 |
CY7C1313KV18 系列 18Mb (1M x 18) QDR® II SRAM 四字突发架构
|
||
CY7C1313KV18-250BZXC
|
Cypress Semiconductor | 类似代替 | FBGA-165 |
SRAM Chip Sync Dual 1.8V 18M-Bit 1M x 18 0.45ns 165Pin FBGA Tray
|
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