Technical parameters/digits: 36
Technical parameters/access time (Max): 0.45 ns
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 1.7V ~ 1.9V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: LBGA-165
External dimensions/packaging: LBGA-165
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 3A991.b.2.a
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY7C1314KV18-250BZI
|
Cypress Semiconductor | 完全替代 | FBGA-165 |
18 - Mbit的QDR ? II SRAM双字突发架构 18-Mbit QDR? II SRAM Two-Word Burst Architecture
|
||
CY7C1314KV18-250BZXC
|
Cypress Semiconductor | 功能相似 | FBGA-165 |
18 - Mbit的QDR ? II SRAM双字突发架构 18-Mbit QDR? II SRAM Two-Word Burst Architecture
|
||
CY7C1314KV18-250BZXI
|
Cypress Semiconductor | 功能相似 | LBGA-165 |
QDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15MM, 1.4MM HEIGHT, LEAD FREE, MO-216, FBGA-165
|
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