Technical parameters/power supply voltage: 1.7V ~ 1.9V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: LBGA-165
External dimensions/packaging: LBGA-165
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CY7C1315KV18-300BZXC
|
Cypress Semiconductor | 类似代替 | FBGA-165 |
18兆位QDR® II SRAM四字突发架构 18-Mbit QDR® II SRAM Four-Word Burst Architecture
|
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