Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: 0803
External dimensions/packaging: 0803
Other/Product Lifecycle: End of Life
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CRA06E0831K50JTA
|
Vishay Dale | 类似代替 | 1206 |
Res Thick Film Array 1.5KΩ 5% ±200ppm/℃ ISOL Molded 8Pin 1206 Convex SMD Paper T/R
|
||
CRA06E0831K50JTA
|
VISHAY | 类似代替 | 1206 |
Res Thick Film Array 1.5KΩ 5% ±200ppm/℃ ISOL Molded 8Pin 1206 Convex SMD Paper T/R
|
||
CRA06E0831K50JTA
|
Vishay Semiconductor | 类似代替 | 1206 |
Res Thick Film Array 1.5KΩ 5% ±200ppm/℃ ISOL Molded 8Pin 1206 Convex SMD Paper T/R
|
||
CRA06S0831K50JTB
|
Vishay Dale | 类似代替 | 1206 |
Res Array 4 Res 1.5KΩ 1206
|
||
CRA06S0831K50JTC
|
Vishay Semiconductor | 类似代替 | 1206 |
Res Thick Film Array 1.5KΩ 5% ±200ppm/℃ ISOL Molded 16Pin 1206 Convex SMD Paper T/R
|
||
CRA06S0831K50JTC
|
Vishay Dale | 类似代替 | 1206 |
Res Thick Film Array 1.5KΩ 5% ±200ppm/℃ ISOL Molded 16Pin 1206 Convex SMD Paper T/R
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review