Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 6
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CNY174VM
|
ON Semiconductor | 功能相似 | PDIP-6 |
光电晶体管光耦合器 Phototransistor Optocouplers
|
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