Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CD74HC157E
|
TI | 完全替代 | DIP-16 |
TEXAS INSTRUMENTS CD74HC157E 逻辑芯片, 多路复用器, 2输入, CMOS, 高速, 16DIP
|
||
CD74HC157E
|
Harris | 完全替代 | DIP |
TEXAS INSTRUMENTS CD74HC157E 逻辑芯片, 多路复用器, 2输入, CMOS, 高速, 16DIP
|
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