Technical parameters/number of pins: 313
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 40 ℃
Technical parameters/power supply voltage: 4.5V ~ 5.5V
Technical parameters/power supply voltage (Max): 5.5 V
Technical parameters/power supply voltage (Min): 4.5 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 313
Encapsulation parameters/Encapsulation: BGA-313
External dimensions/length: 35.0 mm
External dimensions/width: 35.0 mm
External dimensions/packaging: BGA-313
External dimensions/thickness: 2.30 mm
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Other/Manufacturing Applications: PCI To VME bridge
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
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