Technical parameters/polarity: Male
Technical parameters/Contact electroplating: Gold
Technical parameters/frequency: 11 GHz
Technical parameters/insulation resistance: 5000 MΩ
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -65 ℃
Encapsulation parameters/installation method: Panel
External dimensions/length: 25 mm
External dimensions/width: 25.4 mm
External dimensions/height: 25.4 mm
Physical parameters/shell color: Silver
Physical parameters/contact material: Beryllium Copper
Physical parameters/medium materials: Tetrafluoroethylene (TFE)
Physical parameters/operating temperature: -65℃ ~ 125℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: Industrial, RF Communications, RF communication, industrial
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/ELV standards: Compliant
Compliant with standards/REACH SVHC standards: No SVHC
Customs information/ECCN code: EAR99
Customs information/HTS code: 8536694010
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC23558
|
Multicomp | 类似代替 |
MULTICOMP MC23558 射频同轴连接器, N型
|
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