Technical parameters/dissipated power: 300 mW
Technical parameters/test current: 5 mA
Technical parameters/voltage regulation value: 8.2 V
Technical parameters/operating temperature (Max): 150 ℃
Technical parameters/operating temperature (Min): -65 ℃
Technical parameters/dissipated power (Max): 300 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 2
Encapsulation parameters/Encapsulation: SOD-523
External dimensions/length: 1.25 mm
External dimensions/width: 0.85 mm
External dimensions/height: 0.65 mm
External dimensions/packaging: SOD-523
Physical parameters/temperature coefficient: 4.3 mV/K
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/REACH SVHC standards: No SVHC
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BZX585-C8V2,115
|
NXP | 完全替代 | SOD-523 |
SOD-523 8.2V 300mW
|
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