Technical parameters/breakdown voltage: 32.0 V
Technical parameters/dissipated power: 500 mW
Technical parameters/test current: 5 mA
Technical parameters/voltage regulation value: 30 V
Technical parameters/operating temperature (Max): 175 ℃
Technical parameters/operating temperature (Min): -65 ℃
Technical parameters/dissipated power (Max): 500 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 2
Encapsulation parameters/Encapsulation: DO-213
External dimensions/length: 2 mm
External dimensions/width: 1.2 mm
External dimensions/height: 1.2 mm
External dimensions/packaging: DO-213
Other/Packaging Methods: Tape & Reel (TR)
Other/Minimum Packaging: 2500
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BZX384-C30
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NXP | 功能相似 | SOD-323 |
300mW,BZX384 系列,NXP Semiconductors 齐纳电压容差为 2% (BZX384-B) 和大约 5% (BZX384-C) 表面安装外壳:SOD-323 (SC-76) ### 齐纳二极管,NXP Semiconductors
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