Package parameters/number of pins: 14
Encapsulation parameters/Encapsulation: LSSOP
External dimensions/packaging: LSSOP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BU4066BCFV-E2
|
ROHM Semiconductor | 功能相似 | SSOP-14 |
高电压CMOS逻辑IC \u003c模拟开关\u003e High Voltage CMOS Logic ICs
|
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