Technical parameters/Holding current (Max): 15 mA
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TO-252
External dimensions/length: 6.73 mm
External dimensions/width: 6.22 mm
External dimensions/height: 2.38 mm
External dimensions/packaging: TO-252
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BT136S-800,118
|
NXP | 功能相似 | TO-252-3 |
Bt136s-800 - 四象限三端双向可控硅
|
||
|
|
Philips | 功能相似 |
Bt136s-800 - 四象限三端双向可控硅
|
|||
BT136S-800,118
|
We En Semiconductor | 功能相似 | TO-252-3 |
Bt136s-800 - 四象限三端双向可控硅
|
||
BT136S-800E,118
|
NXP | 类似代替 | TO-252-3 |
TRIAC 800V 4A(RMS) 27A 3Pin(2+Tab) DPAK T/R
|
||
BT136S-800E,118
|
We En Semiconductor | 类似代替 | TO-252-3 |
TRIAC 800V 4A(RMS) 27A 3Pin(2+Tab) DPAK T/R
|
||
BT136S-800F,118
|
NXP | 功能相似 | TO-252-3 |
Thyristor TRIAC 800V 27A 3Pin(2+Tab) DPAK T/R
|
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