Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOP
External dimensions/length: 5 mm
External dimensions/width: 4 mm
External dimensions/packaging: SOP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
BSP752RXT
|
Infineon | 功能相似 | SOIC-8 |
Power Switch Hi Side 1.3A Automotive 8Pin DSO
|
||
BSP752T
|
Infineon | 功能相似 | PG-DSO-8 |
INFINEON BSP752T 智能电源开关, SIPMOS技术, 高压侧, 1路输出, SOIC-8
|
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