Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
UCC3957M-1
|
TI | 功能相似 | SSOP-16 |
3,4节Lithium-Ion电池保护器
|
||
UCC3957M-2
|
TI | 功能相似 | SSOP-16 |
三或四芯锂离子电池保护电路 THREE-OR FOUR-CELL LITHIUM-ION PROTECTOR CIRCUIT
|
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