Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): 55 ℃
Technical parameters/power supply voltage (Max): 1.575 V
Technical parameters/power supply voltage (Min): 1.425 V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: FBGA
External dimensions/length: 23 mm
External dimensions/width: 23 mm
External dimensions/height: 1.73 mm
External dimensions/packaging: FBGA
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AX1000-2FGG484
|
SOC | 类似代替 | BGA-484 |
Field Programmable Gate Array, 12096 CLBs, 1000000Gates, 870MHz, 18144-Cell, CMOS, PBGA484, 1MM PITCH, ROHS COMPLIANT, FBGA-484
|
||
AX1000-2FGG484I
|
Microsemi | 类似代替 | BGA-484 |
Field Programmable Gate Array, 12096 CLBs, 1000000Gates, 870MHz, 18144-Cell, CMOS, PBGA484, 1MM PITCH, ROHS COMPLIANT, FBGA-484
|
||
AX1000-2FGG484I
|
SOC | 类似代替 | BGA-484 |
Field Programmable Gate Array, 12096 CLBs, 1000000Gates, 870MHz, 18144-Cell, CMOS, PBGA484, 1MM PITCH, ROHS COMPLIANT, FBGA-484
|
||
AX1000-FGG484I
|
SOC | 功能相似 | BGA-484 |
350 MHz的系统性能， 500MHz的内部性能 350 MHz System Performance, 500 MHz Internal Performance
|
||
AX1000-FGG484I
|
Microchip | 功能相似 | FBGA |
350 MHz的系统性能， 500MHz的内部性能 350 MHz System Performance, 500 MHz Internal Performance
|
||
AX1000-FGG484I
|
Microsemi | 功能相似 | FBGA-484 |
350 MHz的系统性能， 500MHz的内部性能 350 MHz System Performance, 500 MHz Internal Performance
|
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