Technical parameters/rated current: 1 A
Technical parameters/number of rows: 1
Technical parameters/number of pins: 6
Technical parameters/rated voltage: 125 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 6
Physical parameters/shell color: Natural
Physical parameters/contact material: Copper Alloy
Physical parameters/operating temperature: -40℃ ~ 105℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
10114828-10106LF
|
AFCI | 完全替代 |
Conn Wire to Board HDR 6POS 1.25mm Solder ST SMD T/R
|
|||
10114828-10106LF
|
FCI Electronics | 完全替代 |
Conn Wire to Board HDR 6POS 1.25mm Solder ST SMD T/R
|
|||
10114828-10106LF
|
Future Communications IC | 完全替代 |
Conn Wire to Board HDR 6POS 1.25mm Solder ST SMD T/R
|
|||
53398-0671
|
Molex | 类似代替 | SMD |
MOLEX 53398-0671. 线至板连接器, 针座 6路, 1.25MM
|
||
53398-0671
|
Molex | 类似代替 | SMD |
MOLEX 53398-0671. 线至板连接器, 针座 6路, 1.25MM
|
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