Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP-24
External dimensions/packaging: DIP-24
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards:
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ATF750C-10PU
|
Microchip | 功能相似 | PDIP-24 |
复杂可编程逻辑设备
|
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