Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSOP-32
External dimensions/packaging: TSOP-32
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AT45DB321-TC
|
ATMEL | 功能相似 | TSOP |
Flash Mem Serial-SPI 3.3V 32M-Bit 30ns 32Pin TSOP-I
|
||
AT45DB321-TC
|
Microchip | 功能相似 | TFSOP-32 |
Flash Mem Serial-SPI 3.3V 32M-Bit 30ns 32Pin TSOP-I
|
||
AT45DB321B-TC
|
Microchip | 功能相似 | TSOP-32 |
NOR闪存 32M bit
|
||
AT45DB321B-TI
|
ATMEL | 功能相似 | TSOP |
Flash Mem Serial-SPI 3V/3.3V 32M-Bit 20ns 32Pin TSOP-I
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review