Technical parameters/access time (Max): 90 ns
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Physical parameters/operating temperature: -40℃ ~ 125℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
24AA128T-I/MNY
|
Microchip | 功能相似 | TDFN-8 |
24AA128/24FC128/24LC128 I²C™ 串行 EEPROM ### EEPROM 串行存取 - Microchip
|
||
CAV24C16WE-GT3
|
ON Semiconductor | 功能相似 | SOIC-8 |
ON SEMICONDUCTOR CAV24C16WE-GT3 EEPROM, 16 Kbit, 2K x 8位, 100 kHz, 串行 I2C, SOIC, 8 引脚
|
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